Kenmerken:
Thermal silicone pad for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Specificaties:
Dimensions: 100 x 100 x 1 mm
Net weight: 23 g
Color: grey
Thermal conductivity: 2.0 W/m-K
Specific gravity: 1.7 +0.1 g/cm3
Hardness: 40 ± 5 Shore C
Continuous use temp: -40 ... +250 ?
Dielectric breakdown voltage: ?3-5 KV
Dielectric constant: ?4.5 - 5.5 1M Hz
Volume resistivity: >4.0 x 1011 ?.cm
Flame rating: V-0
Thermal impedance: 0.18 ... 0.25 ?-in2/W